After a film is processed on a plastic substrate made on a glass substrate, a delamination (debonding) process to peel off the glass substrate from the plastic substrate is required.
During manufacturing of touch screens (TP, on-cell, OGS), organic matters (oil film, etc.) may adhere to the panel surface. In addition, during manufacturing of the panels (LCD, organic EL panel; OLED), cullet (waste glasses) may adhere to the surface of a panel. In such situations air bubbles are likely to occur in a lamination process.
Such foreign matter adherence will lead to low yield and "polishing" process is an important step to remove such causes. Now there is a market demand to reliably remove the foreign matter from surface of liquid crystal panels (LCD), organic EL panels (OLED), and touch panels (TP).
In the production of touch screens (TP, on-cell, OGS) and panels (LCD, organic EL panel; OLED), foreign matter (cullet, organic matter) may re-adhere to the panel surface after the surface polishing process.
With "Cleaning" which is a post-processing of polishing, high level of drying performance to remove dust particles from the surface of the panel is required.
With process that controls best lamination position and posture of flexible devices, and features the lamination roller that can control pressure, speed, and thrust amount, it can give the best lamination condition for each of the line (tangential) contact points, under non-vacuum condition. As a carrier tape is used to hold flexible devices, it can also handle ones with non-rectangular shapes.
In the production of touch screens (TP, on-cell, OGS) and panels (LCD, organic EL panel; OLED), there is a process to paste a film on the panel surface.
The "Lamination" process is the key for securing quality as it is the last step, where accuracy without causing stress to the film is required.
In the production of touch screens (TP, on-cell, OGS) and panels (LCD, organic EL panel; OLED), both bonding cover glass and touch screen, and bonding cover glass and panel are the steps required.
It is required, when using adhesive materials such as OCA and UV curable resin (OCR, LOCA), to bond the entire surface, while accurately controlling the film thickness and eliminating air bubbles and foreign substances.
Our puncher is applicable for film substrates which come in both roll or sheet, full or half punches at inside substrates, and full punches at the edges of final deliverables. With combination of customized blades and servomotors it numerically controls speed and height, realizing precision processes that do not give stress at the cut surface and do not negatively influence the next steps of lamination process.